General Specifications
Platform: Desktop
Market Segment: Mainstream Desktop
Product Family: AMD Ryzen™ Processors
Product Line: AMD Ryzen™ 5 Desktop Processors
Consumer Use: Yes
Regional Availability: Global, China, NA, EMEA, APJ, LATAM
Former Codename: "Cezanne"
Architecture: "Zen 3"
# of CPU Cores: 6
Multithreading (SMT): Yes
# of Threads: 12:
Max. Boost Clock : Up to 4.2GHz
Base Clock: 3.6GHz
L1 Cache: 384KB
L2 Cache: 3MB
L3 Cache: 16MB
Default TDP: 65W
Processor Technology for CPU Cores: TSMC 7nm FinFET
CPU Compute Die (CCD) Size: 180mm²
Package Die Count: 1
Unlocked for Overclocking : Yes
CPU Socket: AM4
Socket Count: 1P
Supporting Chipsets:
X570
X470
X370
B550
B450
B350
A520
CPU Boost Technology: Precision Boost 2
Instruction Set: x86-64
Supported Extensions: AES, AMD-V, AVX, AVX2, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64
Thermal Solution (PIB): AMD Wraith Stealth
Max. Operating Temperature (Tjmax): 90°C
Launch Date: 4/4/2022
*OS Support
Windows 11 - 64-Bit Edition
Windows 8.1 - 64-Bit Edition
RHEL x86 64-Bit
Ubuntu x86 64-Bit
*Operating System (OS) support will vary by manufacturer.
Connectivity
USB Type-C® Support: Yes
Native USB 4 (40Gbps) Ports: 0
Native USB 3.2 Gen 2 (10Gbps) Ports: 4
Native USB 3.2 Gen 1 (5Gbps) Ports: 0
Native USB 2.0 (480Mbps) Ports: 0
Native SATA Ports: 2
PCI Express® Version: PCIe 3.0
Native PCIe® Lanes (Total/Usable): 24/20
Additional Usable PCIe Lanes from Motherboard
AMD X570
16x Gen 3
AMD X470
2x Gen 3
AMD X470
8x Gen 2
NVMe Support
Boot, RAID0, RAID1, RAID10
System Memory Type: DDR4
Memory Channels: 2
Max. Memory: 128GB
System Memory Subtype: UDIMM
System Memory Specification: Up to 3200MHz
Max Memory Speed: 2x1R
DDR4-3200
2x2R
DDR4-3200
4x1R
DDR4-2933
4x2R
DDR4-2667
ECC Support
No
Graphics Capabilities
Integrated Graphics: No
Graphics Model: Discrete Graphics Card Required
Product IDs
Product ID Boxed
100-100000457BOX
Product ID Tray
100-000000457
Key Features
Supported Technologies
AMD StoreMI Technology
AMD Ryzen™ VR-Ready Premium